Integration into your company's testing system, OEM products for equipment manufacturers!
The "PH-101T" is a compact wafer hot chuck that can uniformly heat ultra-thin workpieces such as wafers and glass substrates, with a maximum temperature of 300°C. Its top plate structure allows for compatibility with several types of workpieces through plate replacement. The workpieces are fixed by vacuum suction, which does not impose stress on them. Additionally, precise temperature control is possible with the MSA digital temperature controller. Customization is available for size, suction patterns, and temperature. We also offer custom solutions for the method of fixing to the hot chuck stage, so please feel free to consult us. ● For more details, please download the catalog or contact us.
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basic information
【Specifications】 ○ Temperature control range: Room temperature to 300℃ ○ Chuck surface size: φ4" mm ○ Temperature accuracy: ±1.5% ● For more details, please download the catalog or contact us.
Price information
For more details, please contact us.
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Wafer Hot Chuck
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Company information
We invite production engineers and manufacturing staff to visit the MSA Factory website, which provides strong support!
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