Automation is possible at various points! Instant measurement of copper film thickness and the potential for increased production efficiency through advanced statistical processing is here!
How about fully automated measurement for the inspection of copper plating film thickness? The handheld copper plating thickness measurement device "Cabidarm" can automate various points such as the plating process, final inspection process, and incoming inspection. 【Features】 ○ Measurements are taken instantly ○ The dedicated probe does not scratch the substrate ○ It is possible to connect to a PC via USB cable for advanced statistical processing For more details, please contact us or download the catalog.
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【Specifications】 ○Minimum required area: 12.7mm × 12.7mm ○Measurement accuracy: ±5% ○Measurement range: 2.5μm to 200μm ○Probe size: 63mmL × 20φ ●For more details, please contact us or download the catalog.
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Starting with printed circuit boards, we provide cutting-edge technology to electronic component manufacturers in Japan through the sale of manufacturing equipment for major electronic components such as semiconductors, LCDs, and PDPs, as well as inspection and analysis equipment. Although we operate as a trading company, we leverage our many years of experience in resist coating as a "trading company that can speak about technology" to offer optimal solutions to various customers, and we will continue to contribute to the Japanese electronic component industry.