You can select a measurement method that suits your measurement application (sample). Measurements can be taken under various conditions such as implemented products, strain, and when cooled!
The DFP module (AXP) can measure non-continuous flat surfaces (island-like) such as products with steps, packages with solder balls, and boards with recesses that could not be measured with shadow moire. The gantry fixture allows for movable measurement positions (capable of moving to specific locations on large samples). It is also possible to measure small structures such as connector holes with high-resolution XY (over 1.9 million pixels) and automatic mask processing. 【Features of Other Options】 - DFP2: Capable of measuring mounted items (steps, solder balls, unevenness, etc.) - DIC2.0: Capable of measuring strain (expansion, contraction, etc.) - SRT: Capable of heating/cooling from -55°C to 300°C - Visualization of both-sided behavior during mounting (reflow) is possible. 【Specifications】 ○ Compatible models – AXP ○ Maximum FOV (Field of View) – 100mm x 100mm ○ Maximum sample size – 400mm x 400mm For more details, please contact us or download the catalog.
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Starting with printed circuit boards, we provide cutting-edge technology to electronic component manufacturers in Japan through the sale of manufacturing equipment for major electronic components such as semiconductors, LCDs, and PDPs, as well as inspection and analysis equipment. Although we operate as a trading company, we leverage our many years of experience in resist coating as a "trading company that can speak about technology" to offer optimal solutions to various customers, and we will continue to contribute to the Japanese electronic component industry.