Ion beam milling device
Scia Systems GmbH was established by key staff who developed the software and hard wafers for the ion beam trimming (trimming processing, IBF) equipment IonScan from Roth&Rau AG and MicroSystems GmbH. Scia Systems develops unique and proprietary cutting-edge ion beam and plasma technologies, handling equipment from research and development to mass production.
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basic information
●Features This is a milling device that uses the ECR ion beam MW218-e manufactured by Seki Systems, compatible with physical and chemical reaction ion beam etching processes. ●Applications As a microfabrication device, we propose this equipment as ideal for various applications such as thin-film magnetic heads, sensors, MRAM, and ion beam smoothing. Please feel free to contact us for more details about this device.
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Scia Systems GmbH was established by key staff who developed the software and hard wafers for the IonScan device, an ion beam trimming (trimming processing, IBF) equipment from Roth&Rau AG and MicroSystems GmbH. Scia Systems develops unique and proprietary cutting-edge ion beam and plasma technologies, handling equipment from research and development to mass production.
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Company information
Our company website features information on used equipment related to FPD and semiconductors. ● Main Business Activities Purchase of used semiconductor manufacturing equipment, refurbishment, sales, and setup operations Construction and consulting for semiconductor manufacturing lines Purchase of used FPD manufacturing equipment, refurbishment, sales, and setup operations Construction and consulting for FPD manufacturing lines Contract development, manufacturing, and sales of semiconductor manufacturing equipment and FPD manufacturing equipment Sales of various equipment parts Agency sales of overseas manufactured equipment