[Laser Micromachining Examples] Hole Processing Examples for Ceramic, Stainless Steel Plates, and Polyimide
Introducing three examples of micro-hole processing! You can also view processing photos from the left. ■ Hole processing of Φ1 mm in ceramic It can be seen that a vertical hole without taper has been made in a 1 mm thick ceramic (AlN). Additionally, there is no thermal impact, resulting in very clean edges. ■ Inverted taper hole processing This is a cross-section view of the hole processing results. Holes were processed in a 1 mm thick stainless steel plate. The photo shows the results of laser processing from left to right. The taper is controlled, resulting in an inverted taper on the laser emission side of the hole. ■ Hole processing of polyimide This is the laser entry side. Holes with a diameter of 25 µm have been processed. The edges are very clean, and there is almost no thermal impact. The material is 25 µm thick polyimide. This is applied to inkjet nozzles, processing over 1,000 holes per head. For more details on various examples of laser processing, please download and view "Case Studies on the Introduction and Problem Solving of Laser Microprocessing Machines Vol. 1" from the link below.
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Hikari Corporation is a joint venture with Germany's 3D-Micromac, a world-class manufacturer of laser microprocessing equipment, and acts as the exclusive agent in Japan. The company has introduced picosecond laser microprocessing equipment manufactured by 3D-Micromac, enabling high-quality processing for drilling, cutting, and marking on various materials using this cutting-edge laser microprocessing technology. *For detailed information on equipment introduction and processing achievements, please download and view the brochure.*
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【Medical and Life Sciences Field】 Various markings, medical stent processing, thrombus filter processing, microchannel formation, ophthalmic treatment, injection needle processing, leak test holes, biochip mold processing, laser scalpel, protein crystallization, hollow fine needles, etc. 【Solar Cell Field】 Through-hole processing, edge isolation, P1, P2, P3 scribing, marking, wafer dicing, organic material coating, drying furnace, texturing, device cutting, laser welding. 【Electrical and Electronics Field】 Through-hole processing, wafer cutting, insulation processing/trimming, marking, pinhole processing, electrode formation, metal mask processing, lens cutting, 3D printing, device cutting, texturing, internal glass marking. 【Precision Instruments Field】 Optical waveguide processing, fine mold processing, watch parts processing, microchannel formation, inkjet nozzle processing, resin parts cutting, surface roughness control, fine welding, gear processing, electrode processing, fine marking, fine nozzle processing. For more details on our introduction and processing achievements, please download the brochure or contact us directly.
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We are a joint venture with Germany's 3D-Micromac, a world-class manufacturer of laser microfabrication equipment, and we operate as the general agent in Japan. Microfabrication equipment using picosecond and femtosecond lasers is widely applied in the production of thin-film solar cells, organic EL for lighting, automotive parts, precision machine components, cutting and drilling of transparent materials with internal marking, and medical devices. Additionally, high-precision inkjet nozzle micro-drilling equipment using excimer lasers is also adopted by world-class inkjet manufacturers. We strive to meet our customers' advanced microfabrication requirements and contribute to the technological innovation of Japan's manufacturing industry.
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