[Laser Micromachining Examples] Mesh processing of stainless steel, dimple processing on brass.
Introducing two machining examples related to high-speed fine multi-hole processing! You can also view processing photos from the left. ■ Mesh Processing of Stainless Steel We created a mesh structure by machining through holes with a diameter of Φ30µm at a pitch of 50µm in stainless steel SUS430 with a thickness of 100 µm. The number of holes exceeds 80,000. The processing speed is 0.25 seconds per hole. It is possible to arrange the holes in a staggered pattern, as well as in a grid layout as shown in the photo. Additionally, larger area mesh processing is also possible. Since we are scanning the laser spot to create holes, we can achieve various shapes of holes, including round, elongated, square, and triangular holes. ■ Dimple Processing on Brass This processing involves arranging stop holes with a diameter of Φ30µm and a depth of 15µm at a pitch of 40µm. The laser can process not only through holes but also stop holes. We can produce more than 30 dimples per second. The pitch and depth can be freely set. While some lasers cannot process brass, 3D-Micromac has the know-how to process it based on years of experience. *For more details on various other examples, please download and view "Laser Fine Processing Machine Introduction & Problem-Solving Case Study Collection Vol. 1" from the link below.
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Hikari Corporation is a joint venture with Germany's 3D-Micromac, a world-class manufacturer of laser microprocessing equipment, and acts as the exclusive agent in Japan. The company has introduced picosecond laser microprocessing equipment manufactured by them, achieving high-quality processing for drilling, cutting, and marking on various materials with this state-of-the-art laser microprocessing equipment. *For detailed information on equipment introduction and processing achievements, please download and view the brochure.*
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【Medical and Life Sciences Field】 Various markings, medical stent processing, thrombus filter processing, microchannel formation, ophthalmic treatment, injection needle processing, leak test holes, biochip mold processing, laser scalpel, protein crystallization, hollow microneedles, etc. 【Solar Cell Field】 Through-hole processing, edge isolation, P1, P2, P3 scribing, marking, wafer dicing, organic material coating, drying furnace, texturing, device cutting, laser welding. 【Electrical and Electronics Field】 Through-hole processing, wafer cutting, insulation processing/trimming, marking, pinhole processing, electrode formation, metal mask processing, lens cutting, 3D printing, device cutting, texturing, internal glass marking. 【Precision Instruments Field】 Optical waveguide processing, fine mold processing, watch parts processing, microchannel formation, inkjet nozzle processing, resin parts cutting, surface roughness control, fine welding, gear processing, electrode processing, fine marking, fine nozzle processing. For more detailed information on our introduction and processing achievements, please download the brochure or contact us directly.
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We are a joint venture with Germany's 3D-Micromac, a world-class manufacturer of laser microfabrication equipment, and we operate as the general agent in Japan. Microfabrication equipment using picosecond and femtosecond lasers is widely applied in the production of thin-film solar cells, organic EL for lighting, automotive parts, precision machine components, cutting and drilling of transparent materials with internal marking, and medical devices. Additionally, high-precision inkjet nozzle micro-drilling equipment using excimer lasers is also adopted by world-class inkjet manufacturers. We strive to meet our customers' advanced microfabrication requirements and contribute to the technological innovation of Japan's manufacturing industry.
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