[Laser Microprocessing Examples] Examples of Y-shaped and C-shaped hole processing, and grooved round hole processing.
Introducing four machining examples related to precision shape cutting! You can also view processing photos from the left. ■ Y-shaped hole machining Holes can be drilled into stainless steel plates thicker than 500 µm while controlling the taper. This is from the laser entry side. The processing time was 100 seconds. 3D-Micromac excels at machining irregular holes while controlling the taper. ■ C-shaped hole machining The hole shape is completely customizable. This shows the laser exit side. We respond to strict dimensional tolerance requirements with precise laser processing. It is gaining attention as an alternative to wire electrical discharge machining (EDM). ■ Y-shaped hole machining Y-shaped holes are being machined into a 500 µm thick stainless steel plate. This is a SEM photo from the laser entry side. The groove width is 50 µm. The edges are sharp. ■ Grooved round hole machining We are machining round holes with grooves. It is possible to cut out freely shaped designs like this. It has received high praise as a highly productive device. For more details on various other examples, please download and view "Laser Microprocessing Machine Introduction & Problem-Solving Case Collection Vol. 1" from the link below.
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Kou Corporation is a joint venture with Germany's 3D-Micromac, a world-class manufacturer of laser microprocessing equipment, and acts as the exclusive agent in Japan. We have introduced their picosecond laser microprocessing equipment, which enables high-quality processing for drilling, cutting, and marking on various materials using this state-of-the-art laser microprocessing technology. *For detailed information on equipment introduction and processing achievements, please download and view the brochure.*
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【Medical and Life Sciences Field】 Various markings, medical stent processing, thrombus filter processing, microchannel formation, ophthalmic treatment, injection needle processing, leak test holes, biochip mold processing, laser scalpel, protein crystallization, hollow fine needles, etc. 【Solar Cell Field】 Through-hole processing, edge isolation, P1, P2, P3 scribing, marking, wafer dicing, organic material coating, drying furnace, texturing, device cutting, laser welding. 【Electrical and Electronic Field】 Through-hole processing, wafer cutting, insulation processing/trimming, marking, pinhole processing, electrode formation, metal mask processing, lens cutting, 3D printing, device cutting, texturing, internal glass marking. 【Precision Instruments Field】 Optical waveguide processing, fine mold processing, clock parts processing, microchannel formation, inkjet nozzle processing, resin parts cutting, surface roughness control, fine welding, gear processing, electrode processing, fine marking, fine nozzle processing. For more details on our introduction and processing achievements, please download the brochure or contact us directly.
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Company information
We are a joint venture with Germany's 3D-Micromac, a world-class manufacturer of laser microfabrication equipment, and we operate as the general agent in Japan. Microfabrication equipment using picosecond and femtosecond lasers is widely applied in the production of thin-film solar cells, organic EL for lighting, automotive parts, precision machine components, cutting and drilling of transparent materials with internal marking, and medical devices. Additionally, high-precision inkjet nozzle micro-drilling equipment using excimer lasers is also adopted by world-class inkjet manufacturers. We strive to meet our customers' advanced microfabrication requirements and contribute to the technological innovation of Japan's manufacturing industry.
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