Transporting 2 to 12-inch wafers laid flat, gently carried with air cushioning.
The Bernoulli chuck generates a stronger suction force by utilizing Bernoulli's principle to expel air. The transported object makes point contact with the edge of the Bernoulli chuck's surface, allowing it to be transported with stable holding power in a non-contact state at the center of the wafer, without rotation. The main body is designed to accommodate various wafer sizes with just one unit. 【Features】 - The main body can be selected from three angles of use: 20 degrees, 45 degrees, and 90 degrees. - By changing the guide ring compatible with different inches, it can be used for wafers ranging from 2 to 12 inches. - The use of conductive nylon resin for the main body reduces weight. - There are patterns printed on both sides, accommodating wafers that are 50µm thin and difficult to handle. - Custom designs tailored to specific objects, such as square shapes, are also available. For more details, please contact us or download the catalog.
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【Features】 ○ The handle can be set at three angles: 20 degrees, 45 degrees, and 90 degrees. By selecting the appropriate body part and changing the guide ring for the corresponding inch size, it can be used for sizes ranging from 2 to 12 inches. (The usage angles are fixed, and changing the angle requires changing the body part.) ○ The guide stopper has a gentle taper, allowing for point contact with the wafer edge. ○ The guide rings made of transparent acrylic resin for ESD protection allow for visual positioning and confirmation of the suction state. 【Options】 ○ Dedicated stand → Stand for Bernoulli chuck sizes from 6 inches to 2 inches: Code No. 678 → Stand for Bernoulli chuck sizes of 12 inches/8 inches: Code No. 699 ○ For Protos carrier ○ For solar panels ● For more details, please contact us or download the catalog.
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Dainichi Shoji Co., Ltd. was established in 1959 as an import trading company and has since provided products such as temperature sensors, plastic products, consumables, and equipment for the electronics (semiconductor and LCD) industry. In 1997, we established a plastic molding factory in Yonezawa City, Yamagata Prefecture, creating a corporate structure that combines trading and manufacturing functions. At the core of our operations is our "spirit of challenge" to quickly respond to customer requests and problem-solving, along with our commitment to manufacturing. To survive in the rapidly changing electronics industry, we continuously anticipate market demands and diligently strive to provide excellent technology and high-quality products, aiming to be a company trusted by society.