Bernoulli chuck for SiC wafers with an exhaust recovery mechanism
Float Chuck WA-SiC Type
Bernoulli chuck for SiC wafers available for use in clean rooms.
Bernoulli chuck for SiC wafers equipped with an exhaust recovery mechanism, reducing the discharge of exhaust into the clean room and enabling its use within the clean room.
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basic information
1. Exhaust Recovery Mechanism: The cleanroom-compatible Bernoulli chuck "Float Chuck WASiC type" for SiC wafers and substrates consists of an operating surface facing the held wafer, a cushion chamber provided at the center of the operating surface, a nozzle located at the center of the cushion chamber, and a hood surrounding the outer periphery of the operating surface. The high-speed airflow ejected from the nozzle flows into the gap between the operating surface and the wafer without contacting the walls of the cushion chamber or the sapphire substrate. The amount of negative pressure generated by the ejector effect occurring in the cushion chamber also increases, allowing for efficient negative pressure generation. The exhaust air that passes through the gap between the operating surface and the sapphire substrate is captured by the surrounding hood and is drawn out through the exhaust port to be discharged at a designated location. As a result, the high-speed air jet rarely flows into the cleanroom, preventing the discharge of debris and the lifting of dust. ◎ Applications - SiC substrates - Sapphire wafers - Gallium arsenide wafers (GaAs)
Price range
P3
Delivery Time
P4
Applications/Examples of results
Non-contact loader/unloader transport device for SiC wafers and SiC substrates.
Company information
Manufacturing of non-contact transport devices and application devices for wafers, liquid crystal glass substrates, PDPs, ceramics, printed circuit boards, FPC substrates, films, paper, cloth, etc., using our patented non-contact transport device "Float Chuck" based on the vertical gas jet method developed by our company.
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