Case study of the iPad 4! TechInsights' teardown allows for understanding the manufacturing cost of the finished product.
Information on which electronic components are used in which products can be viewed from the block diagram level down to the individual semiconductor package size and die size. At the system level and in semiconductors, all packages are opened for cost asset analysis, resulting in very high accuracy in the information provided. By using this tear-down service, it becomes possible to understand the manufacturing costs of competitors and to negotiate costs favorably when procuring finished products through ODM, as it allows for an understanding of the product's cost. If we can reduce the procurement cost in ODM by 200 yen, with an annual production volume of 100,000 units, it would result in a cost reduction of 20 million yen. We also offer a customized tear-down service to analyze specified products individually. Individual meetings can be arranged, so please contact us separately.
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