Military, aerospace, high-end automotive, high-reliability devices/joint CCGA products.
TopLine Corporation, headquartered in Georgia, USA, produces high-reliability devices/joint CCGA products. 【Features】 ■ CCGA (also known as CGA: Column Grid Array) solder column arrangement absorbs stress caused by the mismatch in thermal expansion rates between large ceramic chip packages and FR4 printed circuit boards. ■ CCGA packages offer greater reliability than BGA solder balls. ■ CCGA packages excel in resistance to stress, shock, and harsh operating environments. ■ Solder columns can also be mounted on plastic packages, extending their lifespan. ■ Microcoil spring: A new bonding method invented for applications requiring particularly long lifespans. It can withstand shocks of up to 50,000g. ■ TopLine covers all solutions for CCGA technology and solder columns. ■ A Flip-Pack(TM) with arranged solder columns is also available. *For more details, please contact us or download the PDF materials.
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【Applications】 ■Military ■Aerospace ■High-performance computing ■Downhole drilling ■Luxury vehicles, etc. Particularly for applications that require long lifespan.
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