I will clean and dry the work by draining it.
This is a device with a proven track record as a wafer drying system for the semiconductor industry. It cleans and dries the workpiece using centrifugal force and air flow through an ULPA filter. For more details, please contact us or download the catalog.
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basic information
【Specifications】 ○ Drive Air: 0.3Mpa (3Kg/cm2) ○ Maximum Processing Capacity: 8 inches × 25 sheets carrier 1 carrier ○ ULPA Filter: Yes ○ Ionizer: Yes ○ Control: PLC・Inverter ○ Operation Panel: Touch Panel ○ Number of Operating Recipe Registrations: 5 types ○ Rotation Speed: 3,500rpm (up to 5 inches; 3,000rpm for over 6 inches) ○ Motor: Inverter Motor ○ Power Supply: AC200V 3φ 50/60Hz 8A ○ Dimensions: 652(W) × 1135(D) × 1080(H)mm; Height when lid is open: 1352(H)mm ○ Weight: 110Kg Additionally, we offer devices compatible with up to 8 inches, manual machines, automatic machines, and more. Please feel free to consult us for applications other than semiconductors! ● For more details, please contact us or download the catalog.
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Leave it to us for centrifuges.