Implementation technology for directly mounting LSI bare chips.
Flip chip mounting is one method of mounting bare chips. Compared to wire bonding, it allows for a smaller mounting area and has better electrical characteristics due to shorter wiring. Even though it is called flip chip mounting, there are multiple mounting methods available, and we can propose a method based on your requirements. - It can accommodate a minimum pitch of 80 microns. - It is also possible to mix mount with SMT components.
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basic information
Flip Implementation Method - C4 Method A method of mounting by printing or transferring flux or solder paste onto bare chips with solder bumps. - NCP Method A method of mounting using non-conductive adhesive (NCP) by attaching gold bumps to bare chips and applying heat and pressure. - Gold Bump-Solder Method A method of mounting by attaching gold bumps to bare chips and applying solder paste to the substrate. Underfill and plasma cleaning are also available upon request.
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Applications/Examples of results
Direct implementation of LSI bear chips.
Company information
P-Dub-B Co., Ltd. has been expanding its business areas related to printed circuit boards since its establishment in 1978, and now has built a consistent production system (ADAMS) that handles everything in-house, from software and hardware design to manufacturing and assembly. We flexibly respond to our customers' increasingly diverse and sophisticated needs.
