Implementation technology for directly mounting LSI bare chips.
Flip chip mounting is one method of mounting bare chips. Compared to wire bonding, it allows for a smaller mounting area and has better electrical characteristics due to shorter wiring. Even though it is called flip chip mounting, there are multiple mounting methods available, and we can propose a method based on your requirements. - It can accommodate a minimum pitch of 80 microns. - It is also possible to mix mount with SMT components.
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basic information
Flip Implementation Method - C4 Method A method of mounting by printing or transferring flux or solder paste onto bare chips with solder bumps. - NCP Method A method of mounting using non-conductive adhesive (NCP) by attaching gold bumps to bare chips and applying heat and pressure. - Gold Bump-Solder Method A method of mounting by attaching gold bumps to bare chips and applying solder paste to the substrate. Underfill and plasma cleaning are also available upon request.
Price range
Delivery Time
Applications/Examples of results
Direct implementation of LSI bear chips.
Company information
P-Dub-B Co., Ltd. has been expanding its business areas related to printed circuit boards since its establishment in 1978, and now has built a consistent production system (ADAMS) that handles everything in-house, from software and hardware design to manufacturing and assembly. We flexibly respond to our customers' increasingly diverse and sophisticated needs.
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