We would like to propose a new Pop implementation.
POP implementation (Package on Package) is a technology used in mobile phones and other devices that require high-density packaging, allowing components to be stacked in a three-dimensional manner in two or three layers. While the typical POP implementation involves a CPU on the bottom layer and memory on the top layer, we also propose conversion boards for purposes such as extracting signal patterns from BGA for evaluation or modifying circuits due to pattern errors. We can also accommodate pre-stacking, where components are layered before assembly.
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basic information
We will accommodate your needs, including mounting by solder transfer with a mounter, pre-stacking for implementation, and rework of POP implementation.
Price range
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Applications/Examples of results
This is a conversion board created in response to the request to extract BGA signals to a connector for evaluation from the existing implementation board. Due to the presence of chip components around it, it is stacked in three layers: a riser board (thickness 2.5mm), the conversion board, and the BGA. Signals can be monitored from the connector of the conversion board.
Company information
P-Dub-B Co., Ltd. has been expanding its business areas related to printed circuit boards since its establishment in 1978, and now has built a consistent production system (ADAMS) that handles everything in-house, from software and hardware design to manufacturing and assembly. We flexibly respond to our customers' increasingly diverse and sophisticated needs.