SVH/IVH and composite high multilayer substrate for build-up.
Leveraging the strengths of our integrated production from in-house design, we are able to accommodate the production of narrow-pitch composite substrates for high-layer-count boards, such as semiconductor tester products, through a clever combination of design rules that consider substrate manufacturing at the design stage and the unique substrate processes of our small-batch, diverse product lines.
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basic information
We offer a variety of substrate materials including FR-4, halogen-free materials, high Tg materials, and low dielectric materials, and we can manufacture each of them. Additionally, we accept requests for SVH/IVH, build-up, back drilling, some thick copper, and impedance control. For build-up, we utilize our proprietary drilling machine for mechanical build-up processing (Depth Drill), enabling simultaneous processing of two layers (skip processing, such as between L1-3). At the same time, through mechanical processing, we provide products that improve connection reliability by reducing resin residue at inner layer connection points and minimizing damage to inner layer conductors.
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Applications/Examples of results
Example of combined processing with IVH+ build-up (L1-3, L3-5 available) + inner layer thick copper (200μm).
Company information
P-Dub-B Co., Ltd. has been expanding its business areas related to printed circuit boards since its establishment in 1978, and now has built a consistent production system (ADAMS) that handles everything in-house, from software and hardware design to manufacturing and assembly. We flexibly respond to our customers' increasingly diverse and sophisticated needs.
![[Processing Example] Rivet Assembly Achieving Zero Interference](https://image.mono.ipros.com/public/product/image/2071035/IPROS11625826802589059285.png?w=280&h=280)