Hot melt application system for protecting and waterproofing electrical components and electronic circuit boards.
Precision parts in fields such as automobiles, communications, home appliances, and electronics must achieve high performance at low cost. Additionally, to demonstrate reliable functionality and performance under any environmental conditions, such as heat, humidity, dust, chemicals, and vibration, it is necessary to specially protect the components. The optimal solution is to mold the parts using thermoplastic polyamide/polyester/polyolefin resins and moisture-curing resins (PUR-HM). Nordson offers functional, economical, and highly reliable molding methods. 【Features】 ○ Innovative technology using a single-component thermoplastic high-performance resin that is solvent-free and environmentally friendly. ○ Low pressure allows for the simplest and most diverse molding methods. For more details, please contact us or download the catalog.
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basic information
【Features】 ○ High adhesion to various substrates due to being molded with adhesive-based resin. ○ Low viscosity resin allows filling of fine gaps in various components. ○ Low melting temperature and very short cooling time significantly improve productivity. ○ Low injection pressure allows the use of inexpensive aluminum molds, reducing costs for peripheral equipment. ○ The system is compact and easy to integrate into existing production lines. ○ Low-pressure process minimizes damage to components and substrates. ○ Single-component material eliminates the mixing hassle of two-component materials, with no need for daily cleaning and no waste of material. ● For more details, please contact us or download the catalog.
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Company information
Nordson Corporation, which has expanded its network to 56 locations worldwide, operates as one of the four major regional divisions in Japan, actively providing unique system development and services to meet the market needs for adhesives, coatings, and more for our customers.