Because it's 3D, it can be seen and measured.
3D measurement with strong performance on inclined surfaces using the focus method Industry-leading measurement accuracy Easy variety setting Compatible with loaders and unloaders
Inquire About This Product
basic information
This device is an appearance inspection system that realizes the automation and efficiency of inspections required in the wire bonding process. With the incorporation of 3D measurement capabilities, it enables highly reliable inspections. The high-precision 3D measurements achieve reproducible inspections of the aluminum wire wedge area. Additionally, the newly developed optical system and software processing allow for the measurement of ultra-fine wires with micro pitches.
Price range
P7
Delivery Time
Applications/Examples of results
For measuring power-type small packages and IC-type packages.
catalog（1）
Download All Catalogs
Company information
Since its founding in 1972, our company has upheld the management philosophy of "creativity, sincerity, and challenge." We have been committed to sincerely creating solutions for our customers' needs from their perspective, and at times, we have embraced challenges without fear of failure. With this policy, we have dedicated ourselves to the development of advanced production systems through company-wide efforts to refine our technology. As a result, we have grown into a reliable company with outstanding mechatronics technology and have contributed to the development of the industrial sector. Now, aiming to be a "company that continues to shine in the 21st century," all of our employees are challenging themselves to create and provide further advanced intellectual production systems from the customer's viewpoint and to contribute to society.
![[Data] UV Camera for Semiconductor Microchip Manufacturing Applications](https://image.mono.ipros.com/public/product/image/216061/IPROS15865447606297689904.png?w=280&h=280)