キヤノンマシナリー Product Lineup

Two models are lined up based on the transport form of the work (substrate): ◆ Tray Type This device transports individual substrates stored in a tray and presses each one individually with four upper and lower heads to flatten the C4 bumps on the substrate with high precision. ◆ Jig Type This device takes individual substrates supplied from a tray, positions them using a dedicated jig, and then presses each one individually with four upper and lower heads to flatten the C4 bumps on the substrate with high precision. As a precision pressing device, it can be applied to various testing and production purposes, including presses for Ag sintering.

• Plastic processing machines (cutting and rolling)

3D measurement with strong performance on inclined surfaces using the focus method Industry-leading measurement accuracy Easy variety setting Compatible with loaders and unloaders

• Visual Inspection Equipment

◆Best TCO 　~Small footprint, reduced changeover time~ ◆Best Quality 　~Supports fast-drying paste~ ◆Wide lead frame compatibility 　~Lead frame size: W102mm × L300mm~ ◆Equipped with newly developed twin dispense system 　~Compatible with various pastes, stable coating performance~ ◆High precision small chip pickup 　~Supports sizes from 0.15 to 8.0mm~

• Other semiconductors
• Bonding Equipment

◆Minimize the space between the mount and preform, prevent changes over time, and reduce unnecessary movements. ◆Direct transport of substrates, support for workpiece thickness, support for large substrates (optional), and carrier compatibility. ◆Support for larger and modular lighting substrates, offering a variety of bonding patterns and recognition patterns. ◆Facilitate work data input to reduce changeover time. ~Changeover time: 60 minutes (hardware 15 minutes, setup 45 minutes)~

• Other semiconductor manufacturing equipment

◆Bonding accuracy XY: ±40µm, Θ: ±3° 3σ ◆Inspection and detection of solder joint quality using DBI ◆Powerful setup wizard ◆Option to choose heater rail unit or adapter rail replacement

• Bonding Equipment

◆Reduction of TCO through high throughput, small footprint, and shortened changeover time ◆Enhanced operability achieved with easy adjustments and rework functionality ◆Minimization between mount and preform to prevent changes over time and reduce unnecessary movements ◆Equipped with a newly developed twin dispense system to accommodate various pastes ◆Needleless pickup system (optional) enables damage-free pickup

• Bonding Equipment

The needleless pickup system can pick up ultra-thin chips without damage. World-class bonding precision ~ High precision XY: ±8μm θ: ±0.05 (3σ) ~ Versatile handling ~ Compatible with sizes from 1.0 to 25.0mm and substrate sizes from 100 to 315mm ~

• Bonding Equipment