High-precision coining device with a maximum pressure of 50,000N.
Two models are lined up based on the transport form of the work (substrate): ◆ Tray Type This device transports individual substrates stored in a tray and presses each one individually with four upper and lower heads to flatten the C4 bumps on the substrate with high precision. ◆ Jig Type This device takes individual substrates supplied from a tray, positions them using a dedicated jig, and then presses each one individually with four upper and lower heads to flatten the C4 bumps on the substrate with high precision. As a precision pressing device, it can be applied to various testing and production purposes, including presses for Ag sintering.
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Applications/Examples of results
C4 bump flattening process for FC-BGA / FC-CSP substrates, Ag sintering thermal bonding process.
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Since its founding in 1972, our company has upheld the management philosophy of "creativity, sincerity, and challenge." We have been committed to sincerely creating solutions for our customers' needs from their perspective, and at times, we have embraced challenges without fear of failure. With this policy, we have dedicated ourselves to the development of advanced production systems through company-wide efforts to refine our technology. As a result, we have grown into a reliable company with outstanding mechatronics technology and have contributed to the development of the industrial sector. Now, aiming to be a "company that continues to shine in the 21st century," all of our employees are challenging themselves to create and provide further advanced intellectual production systems from the customer's viewpoint and to contribute to society.