Super soft high thermal conductivity gap filler 100×100× thickness 2.0mm

It is made of a very soft material, so it covers the contact surfaces of multiple parts with uneven mounting surfaces.

It is used by attaching a sheet to the heating element and closely adhering it to the heat dissipation element to conduct heat. It is used by placing it between the heating element and the heat dissipation element. It fills the gaps and unevenness between the heating element and the heat dissipation element, allowing for efficient heat transfer to the heat dissipation element. It exhibits high thermal conductivity while being electrically insulating and is a flexible thermal conductive material. Due to its very soft material, it reduces stress on the substrate and prevents adverse effects from excessive pressure on the semiconductor chip. It is a convenient single-sided adhesive type for installation. Compliant with RoHS directives.

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