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  6. Insulating thermal gap filler for electronic components / YG, YGF series

Insulating thermal gap filler for electronic components / YG, YGF series

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Seika Seven YG/YGF

last updated:Nov 07, 2024

大日精化工業
大日精化工業
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Low molecular weight siloxane-free soft TIM material

This is an insulating thermal grease/gap filler that uses in-house manufactured materials such as urethane resin and composite oxide-based thermal fillers. Tailored for low thermal resistance, it employs resin synthesis and dispersion processing technologies developed over many years, resulting in a thermally conductive resin paste that combines low hardness and high adhesion, taking advantage of urethane properties. Since it does not contain low molecular siloxane, there are no concerns about contact failures due to outgassing inside electronic components. Additionally, the thermal filler uses our own soft-type filler, which reduces wear inside the dispenser and contributes to lower running costs of the equipment. By in-house manufacturing the resin and filler, we have also achieved a reduction in the overall product cost.

    Other electronic parts
DSC_6726改.jpg

Insulating thermal gap filler for electronic components / YG, YGF series

DSC_6726改.jpg
DSC_6726改.jpg
  • Special site - Product/service details - https://pr.mono.ipros.com/daicolor/product/

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basic information

1) 1-component non-curing/adhesive/paste form 2) 2-component room temperature curing/adhesive/paste form C series 1 / 1.8W design - low cost - lightweight - flexibility C series 2 / 2.5W design - low cost - lightweight - flexibility 0 series / 3.2W design - reduced mechanical friction M series / 4.6W design - medium to high thermal conductivity

Price information

Negotiable

Delivery Time

P4

※The delivery time will be approximately two weeks from your request.

Applications/Examples of results

※Applicable Uses - LiB - Power Electronics - LED - Peltier Module, etc...

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Model number overview
YGF-C001 This is a two-component room temperature curing type, 1.8W thermal conductive resin paste, low cost, and low specific gravity.
YGF-C002 This is a two-component room temperature curing type, 2.5W thermal conductive resin paste, low cost, and low specific gravity.
YGF-001 This is a two-component room temperature curing type, 3.2W thermal conductive resin paste, designed to reduce mechanical friction.

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Insulating thermal gap filler for electronic components / YG, YGF series

Insulating thermal gap filler for electronic components / YG, YGF series

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大日精化工業

大日精化工業

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Everywhere in the world, spaces and objects are adorned with color. Dai Nippon Ink & Chemicals not only provides pigments that serve as the foundation for "color," but also offers a range of "products" tailored to coloring needs, including colorants, inks, coatings, and pigment dispersions. Furthermore, Dai Nippon Ink & Chemicals has received high praise for its development capabilities in functional materials and synthetic resins, which are said to be "convenient if such materials are available!"

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