Ultra-thin high-precision processing of W tungsten and its alloys.
Precision machining of high melting point rare metals and their alloy materials: Mo, MoCu, W, WCu. High melting point rare metals possess unique properties such as high melting point, high density, high corrosion resistance, wear resistance, sufficient electrical resistance, low thermal expansion rate, good thermal conductivity, and high radiation absorption capacity, making them applicable in a wide range of fields including medical, electronics, and semiconductors.
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basic information
High-precision processing of heat sinks for LED chips Materials: Mo, MoCu, W, WCu Sizes: 2, 4, 6 inches, thickness from 0.01mm Surface roughness: Ra 0.01 and above Surface plating available: Ni, Au
Price range
P1
Delivery Time
P4
Applications/Examples of results
Heat sink for LED chips Materials: Mo, MoCu, W, WCu Sizes: 2, 4, 6 inches, thickness 0.01 mm and up Surface plating: Ni, Cu, Au
Detailed information
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W Tungsten Wafer 2, 4, 6 inch ultra-thin wafer
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WCu Heat Sink W-10Cu W-15Cu W-20Cu W-25Cu W-30Cu Plating available: Ni/Au
Company information
We are a trading company specializing in material supply and contract processing of parts. We provide materials and products such as ceramics, quartz glass, engineering plastics, pure metals, and alloys to major semiconductor, industrial, and electrical industry companies in Japan. We support our customers' businesses with a three-pronged approach of technical expertise, cost, and quality, from meeting quality and price requirements to material selection proposals!
