A semi-automatic grinding machine for chamfering the outer peripheral edge of a wafer in a simple manner.
Compatible with wafers from φ2 inches to φ6 inches. Supports various materials including Si, glass, SiC, oxides, and compound wafers. Miniaturized for use in research, development, and prototyping processes.
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basic information
This machine is a device that performs chamfering on round workpieces in a simplified manner. The operator sets the workpiece, and the chamfering process is carried out automatically in a semi-automatic manner. The device is a standalone type with a control panel built into the main body.
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Applications/Examples of results
Purpose: Simple chamfering of round-shaped workpieces. We have received orders from the semiconductor industry.
Company information
☆Dedicated Semiconductor Website Now Open!! https://www.wafer-measurement-inspection.com/ At Justem Co., Ltd., we design, manufacture, and sell automation and labor-saving machines for the wafer manufacturing process, including non-contact thickness measurement machines for wafers, wafer thickness sorting machines, automated lapping and polishing machines, and wafer transfer machines, targeting materials such as Si, SiC, and sapphire, through our unique technology development. We have provided these to many customers. We also design, manufacture, and sell specialized machines for electronic component processing and automotive parts processing. We also accept demo measurements for thickness measurement of various materials.
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