It is a compound wafer appearance inspection device for SiC, sapphire, and GaN wafers.
It is effective for inspecting internal micro-pipes, delamination, surface scratches, foreign substances, polishing marks, and more. The inspection system features four optical systems: super macro, differential interference, dark field, and transmission, all equipped with autofocus, allowing inspections to be conducted in the same coordinate system using an automatic stage. Optionally, AFM and wafer thickness measurements can also be added to the same coordinate system. 【Device Applications】 ■ Internal micro-pipes in wafers ■ Internal delamination in wafers ■ Surface scratch inspection, polishing mark inspection ■ Foreign substance inspection (including internal) ■ Measurement of surface roughness and pattern inclination (optional AFM) ■ Inspection of scratches, pits, and bubbles ■ Non-contact thickness measurement (optional thickness gauge) ■ Micro-cracks, pinholes ■ General appearance inspection and more.
Inquire About This Product
basic information
【Device Configuration】 (1) Super Macro (SM-75) - Local observation of wafer using Schlieren imaging - Composite image of the entire wafer from local images (2) Differential Interference Microscopy Station - Dark field and bright field microscopic observation of local wafer (3) Dark Field Oblique Light Imaging Station - Dark field oblique light imaging observation of local wafer surface (4) Polarized Transmission Imaging Station - Polarized transmission imaging observation of local wafer surface (5) Automatic Stage 【Device Applications】 ■ Micro-pipes inside the wafer ■ Veins inside the wafer ■ Surface scratch inspection, polishing mark inspection ■ Foreign object inspection (including internal) ■ Measurement of surface roughness and pattern inclination (optional AFM) ■ Inspection of scratches, pits, and bubbles ■ Non-contact thickness measurement (optional thickness gauge) ■ Micro-cracks, pinholes ■ General appearance inspection
Price range
Delivery Time
Applications/Examples of results
■Micro pipes inside the wafer ■Veins inside the wafer ■Surface scratch inspection, polishing mark inspection ■Foreign matter inspection (including internal) ■Measurement of surface roughness and pattern inclination (optional AFM) ■Inspection for scratches, pits, and bubbles ■Non-contact thickness measurement (optional thickness gauge) ■Micro cracks, pinholes ■Other general appearance inspections
Company information
We provide manufacturing equipment sales, proposals, and services unique to a "technical trading company" that has design know-how and contract/manufacturing partners. We have accumulated achievements through experiments and development with optimal selections tailored to our customers' needs. We will continuously develop new innovative technologies and applied technologies. We offer high-value-added proposals that encompass equipment sales, contract rental services, and consumable parts sales.
