50% performance increase compared to conventional systems! Atmospheric pressure plasma device with low N2 consumption (approximately 45% reduction).
The atmospheric pressure plasma device "Precise Series" is based on nitrogen gas and utilizes dielectric barrier discharge to isolate the workpiece from the electromagnetic field area, using only the radicals excited within the reactor. This allows for continuous processing without damaging the workpiece. Additionally, even when the workpiece is charged, it is discharged, and there is no particle adhesion in the air after processing. 【Features】 ○ Low-temperature processing ○ Damage-free ○ No need for an ionizer device before ESD-free processing ○ Maintenance-free for 2 years ○ Compact and lightweight (compared to other companies: approximately 1/2 or less in volume ratio, approximately 1/3 or less in weight ratio) ○ Semi-permanent long lifespan dielectric electrodes ○ Particle-free ○ Uniform processing for a wide range of workpieces For more details, please contact us or download the catalog.
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basic information
**Advantages of Atmospheric Pressure Plasma Devices** - No drying process required due to dry treatment - Ability to control contact angle (surface energy) - Treatment with active gases (various radicals) allows for processing inside non-woven fabrics and fiber bundles. - Can be easily used as a plasma source for hydrophobic/reduction treatment, etching, and CVD equipment by adding various gases - Particle-free - No exhaust gas treatment required - No physical, electrical, or thermal damage to the treated surface (downstream type) - No charging after treatment (downstream type) - No change in device characteristics even when processing on semiconductor devices - No UV damage to organic surfaces or interiors - No particle generation (downstream type) - Surface drying without residue formation - 45% reduction in nitrogen gas consumption due to the generation of high-density radicals (compared to conventional methods) - Selection of functional groups or amine groups suitable for matrix materials by changing the type of added gas - Direct adhesion technology for various material surfaces - Reduction treatment
Price information
The device price varies depending on the work size (100mm to 3000mm). Please contact us. We are currently manufacturing tabletop experimental machines and conducting on-site experiments.
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Company information
We are expanding a new approach using dry processes to leverage the reliability of our equipment and various know-how cultivated through sales performance, applying its advantages to other markets (such as the battery market and particles) alongside process applications. Our downstream-type high-density plasma source (electrode) processing section is isolated from the workpiece, preventing any electrical or physical damage to the workpiece, and eliminating the effects of ultraviolet light generated during plasma creation. This allows for the only clean processing (particle-free) possible with atmospheric pressure plasma equipment. By changing the added gases, we can selectively impart molecular functionality, enabling interface control according to various surface materials as a processing technology. This is an effective means for direct adhesion, adhesion of dissimilar materials, and enhancing the adhesion of stronger coatings. The processing width (plasma width) can uniformly handle from 100mm to 3000mm. We can also accommodate carbon fiber bundles and fiber bundle shapes, allowing for uniform processing even within the bundles. Additionally, we can handle the same processing for particles. We manufacture tabletop experimental devices of the downstream type, conduct spot-type device experiments (starting from 2.5 million yen), and also carry out on-site experimental sample work.