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  1. Home
  2. Electronic Components and Semiconductors
  3. イー・スクエア
Electronic Components and Semiconductors
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イー・スクエア

EstablishmentAugust 1999
capital8150Ten thousand
addressKyoto/Kumiyama-cho, Kuse-gun/2-1-210 Sakae
phone0774-48-3366
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last updated:Jul 08, 2025
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  • Products/Services(18)
  • catalog(12)
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イー・スクエア Company Profile

The downstream type has a cumulative sales volume of over 1,400 units and provides various surface functionalities with damage-free, particle-free, and uniform processing for wide workpieces.

We are expanding a new approach using dry processes to leverage the reliability of our equipment and various know-how cultivated through sales performance, applying its advantages to other markets (such as the battery market and particles) alongside process applications. Our downstream-type high-density plasma source (electrode) processing section is isolated from the workpiece, preventing any electrical or physical damage to the workpiece, and eliminating the effects of ultraviolet light generated during plasma creation. This allows for the only clean processing (particle-free) possible with atmospheric pressure plasma equipment. By changing the added gases, we can selectively impart molecular functionality, enabling interface control according to various surface materials as a processing technology. This is an effective means for direct adhesion, adhesion of dissimilar materials, and enhancing the adhesion of stronger coatings. The processing width (plasma width) can uniformly handle from 100mm to 3000mm. We can also accommodate carbon fiber bundles and fiber bundle shapes, allowing for uniform processing even within the bundles. Additionally, we can handle the same processing for particles. We manufacture tabletop experimental devices of the downstream type, conduct spot-type device experiments (starting from 2.5 million yen), and also carry out on-site experimental sample work.

Business Activities

■Development, manufacturing, and sales of atmospheric pressure plasma devices ■Development of process applications for the same devices ■Manufacturing and sales of various small experimental devices (downstream type, planar type, spot type) ■Domestic and international display device markets (TFT, OLED), touch panels, and related markets, semiconductor converting market ■Various contract manufacturing

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Products/Services (18)

Pre-dry treatment before direct adhesive bonding using an atmospheric pressure plasma device. product image
Pre-dry treatment before direct adhesive bonding using an atmospheric pressure plasma device.
A new proposal for imparting surface functionality without causing damage in atmospheric pressure plasma. product image
A new proposal for imparting surface functionality without causing damage in atmospheric pressure plasma.
Direct bonding using an atmospheric pressure plasma device. product image
Direct bonding using an atmospheric pressure plasma device.
[Atmospheric Pressure Plasma Device - Example of Problem Solving] Superhydrophilicity Treatment on Teflon Surface product image
[Atmospheric Pressure Plasma Device - Example of Problem Solving] Superhydrophilicity Treatment on Teflon Surface

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catalog(12)

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A new proposal for imparting functionality to surfaces that do not damage work surfaces or electronic devices.

A new proposal for imparting functionality to surfaces that do not damage work surfaces or electronic devices.

TECHNICAL
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Basic Concepts and Benefits of Downstream Atmospheric Pressure Plasma Joining and Bonding

Basic Concepts and Benefits of Downstream Atmospheric Pressure Plasma Joining and Bonding

OTHER
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Improvement of adhesion using plasma devices: Superhydrophilicity on PTFE and PFA surfaces.

Improvement of adhesion using plasma devices: Superhydrophilicity on PTFE and PFA surfaces.

OTHER
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Efficient surface treatment of particles using atmospheric pressure plasma.

Efficient surface treatment of particles using atmospheric pressure plasma.

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news(5)

2022-04-28_16h45_14.png

[Example of Problem Solving] Superhydrophilization treatment on Teflon (PTFE) surface

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We have successfully achieved surface modification of Teflon (PTFE) to a contact angle near 5 degrees (in pure water). The previous maximum value was around 50 degrees, but this has been realized through optimization of recipes and other factors. I am confident that this will contribute to direct adhesion to FCCL copper foil for 6G applications in the future.

Apr 28, 2022

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Invitation to the Converting Technology Seminar 2019

  • SEMINAR_EVENT

Our company will participate in the "Converting Technology Seminar 2019" to be held at the Tokyo venue on July 5 (Friday) and at the Osaka venue on July 12 (Friday). The themes of this Converting Technology Seminar are "Multi-materialization," "Functionality of Resins," and "Adhesion of Dissimilar Materials." In the third part, our president, Takashima, who has significant achievements in atmospheric pressure plasma, will talk about surface treatment, which is essential for bonding. [Third Part Lecture Content] - Various surface modification methods (Corona treatment, wet method, light (UV, excimer)) - Advantages of atmospheric pressure plasma surface modification - Current status of atmospheric pressure plasma surface modification in the LCD market - Differences in characteristics due to features and mechanisms of plasma equipment - Various treatment forms and process-related information *You can move to the detailed page/application form by clicking the "Details/Application" button. We look forward to your participation.

Apr 10, 2019

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Notice of the 159th Regular Research Meeting of the SP Subcommittee of the Japan Society of Vacuum and Surface Science (March 15)

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This is an announcement for the 159th regular research meeting of the SP Division of the Japan Society of Vacuum and Surface Science, to be held on March 15, 2019, at the Katsura Campus of Kyoto University. We will invite researchers and engineers active in academia and industry to give presentations on atmospheric pressure plasma, covering topics from the basics to recent developments. Please note that this research meeting is a rescheduled event originally planned for September 4, 2018, which was canceled due to a typhoon. We sincerely look forward to your participation. 【Lecture Program】 ■ 13:00–14:10 Akitoshi Okino (Tokyo Institute of Technology) "Development of a New Atmospheric Pressure Plasma Device and Its Applications in Medicine, etc." ■ 14:10–14:50 Yuji Okubo (Osaka University) "Plasma Surface Modification Technology for Strong Adhesion of Fluororesin and Dissimilar Materials" ■ 14:50–15:10 Break ■ 15:10–15:50 Masaru Hori (Nagoya University) "Interaction Between Atmospheric Pressure Plasma and Surfaces" ■ 15:50–16:30 Kenji Takashima (E-Square) "Advantages of Atmospheric Pressure Plasma Surface Modification and Its Equipment" *For more details, please refer to the external link or feel free to contact us.

Feb 01, 2019

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Detailed information

Company name イー・スクエア
Contact addresspostalcode 613-0032 Kyoto/ Kumiyama-cho, Kuse-gun/ 2-1-210 SakaeView on map TEL:0774-48-3366 FAX:0774-48-3370
Key PartnersToray, Toray Engineering, Sharp, SDP, JDI, JOLED, Toppan, Konica Minolta, HOYA, Canon, Nippon Electric Glass, Teijin, Sumitomo Chemical, Nippon Sheet Glass, Stanley, Nissha, Alps Alpine, Panasonic, Kyocera, Sony, Shibaura Machine, INNOLUX, AUO, BYD, BOE, CSOT, CHOT, ITRI, Hon Hai Precision Industry, TOKEN, TPK, PANDA, Tenma Beauty Electronics, Huajia Color, University of Tokyo, Nagoya University, Waseda University, public institutions, others.
Industry Electronic Components and Semiconductors
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