Damage-free, particle-free atmospheric pressure plasma device
The atmospheric pressure plasma device "AP Plasma Precise II" is based on nitrogen gas and utilizes dielectric barrier discharge to isolate the workpiece from the electromagnetic field area, using only the radicals excited within the reactor. This allows for continuous processing without damaging the workpiece. Additionally, even when the workpiece is charged, it can be neutralized, and there is no particle adhesion in the air after processing. 【Features】 ○ No need for electrode replacement (dielectric part) ○ Wide processing range (100 mm to 3000 mm) ○ No damage to the processing surface due to the downstream electrode configuration. ○ Maintenance only every two years For more details, please contact us or download the catalog.
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basic information
**Advantages of Atmospheric Pressure Plasma Equipment** ■ No drying process required due to dry treatment ■ Ability to control the desired contact angle ■ Can treat all areas of active gas (various radicals) intrusion ■ Can be used as a plasma source for water-repellent, reduction treatment, etching, and CVD equipment by changing the added gas ■ Compact equipment (space-saving) ■ No post-treatment of exhaust gases required ■ No electrical or physical damage to the treated surface (downstream type) ■ No charge remaining after treatment (downstream type) ■ No change in device characteristics even when treating semiconductor devices (complete high-frequency power shielding) ■ No UV damage during treatment ■ No particle generation (downstream type) ■ Surface drying without residue formation ■ Contribution to productivity improvement by reducing nitrogen gas through high-density radical generation ■ Ability to select supply coupling molecules suitable for adhesive interfaces by changing the type of added gas ■ Particle-free
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Please contact us. We are currently conducting various tabletop experimental machine manufacturing and on-site experiments.
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We are expanding a new approach using dry processes to leverage the reliability of our equipment and various know-how cultivated through sales performance, applying its advantages to other markets (such as the battery market and particles) alongside process applications. Our downstream-type high-density plasma source (electrode) processing section is isolated from the workpiece, preventing any electrical or physical damage to the workpiece, and eliminating the effects of ultraviolet light generated during plasma creation. This allows for the only clean processing (particle-free) possible with atmospheric pressure plasma equipment. By changing the added gases, we can selectively impart molecular functionality, enabling interface control according to various surface materials as a processing technology. This is an effective means for direct adhesion, adhesion of dissimilar materials, and enhancing the adhesion of stronger coatings. The processing width (plasma width) can uniformly handle from 100mm to 3000mm. We can also accommodate carbon fiber bundles and fiber bundle shapes, allowing for uniform processing even within the bundles. Additionally, we can handle the same processing for particles. We manufacture tabletop experimental devices of the downstream type, conduct spot-type device experiments (starting from 2.5 million yen), and also carry out on-site experimental sample work.
