Supports high-density, ultra-miniaturized components! Capable of handling high-difficulty assembly and rework.
At Kei All, we are capable of handling high-difficulty implementations and reworks. Recently, there has been a significant increase in components such as leads and thermal pads. These types of components can be very difficult to rework due to their shape and the configuration of the circuit board, as they tend to be less susceptible to heat. Rework technology is one of Kei All's proud strengths. We are continuously honing our skills to address high-difficulty components, which have been increasing in number due to the miniaturization and high density of parts. 【Features】 ○ Support for high-density, ultra-miniature components such as small camera modules and fine-pitch 0.3mm devices ○ Capability for high-difficulty implementations and reworks ○ Continuous technical training and skill development For more details, please contact us or download the catalog.
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basic information
[Case Study] [All prototype boards with shielded terminal SMT parts CN and LGA mounting are not functioning, and we want to replace CN and reuse LGA.] ○ Since the shielded terminal SMT part CN cannot be reused, it will be replaced with a new one, and the LGA will be reworked and reused. * The reuse of shielded terminal SMT part CN is currently a challenge that the technical team is working on. * The LGA has a high failure rate due to factors such as humidity, and as a countermeasure, we frequently use MacDry and baking, as outlined in the QC process chart. ● For more details, please contact us or download the catalog.
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Company information
Our company was founded in 1990 with four members. At the time of our establishment, we had no equipment, and each of us primarily worked on renovation projects and manual assembly with just a soldering iron. As the miniaturization of components progressed and the number of prototype and development projects involving BGA increased, so did the demand for BGA reballing and jumper wiring. Therefore, we introduced BGA rework equipment before implementing basic devices such as reflow ovens. Since then, we have conducted extensive research in technology alongside numerous customers, and we take pride in having established a level of reliability that satisfies our clients, not only for BGA but also for LGA, POP, underfill applications, and 0402 chip mounting. Other features of our company include the establishment of a RoHS-compliant factory, maintaining a constant inventory, and providing mounting support for cut parts (My Data), which differentiates us from other companies in the same industry. It is our mission to respond to all QCD (Quality, Cost, Delivery) requirements necessary for development and prototype assembly, and we are committed to providing technical support with customer satisfaction as our top priority.
![[Mold Removal Work Achievement Introduction] Certain Factory Ceiling Board](https://image.mono.ipros.com/public/product/image/4ac/2001506025/IPROS75094802144797273566.jpeg?w=280&h=280)
