Support for BGA rework and reballing that cannot afford to fail.
At Kei All, we accept BGA rework even for boards that are not implemented in our own line. If it is at an early stage of the process, rework may be easily performed. We often receive requests for difficult BGA rework and reballing from other assembly companies in the industry. We support "BGA rework and reballing work that cannot afford to fail," especially for high-cost and hard-to-obtain devices. [Features] - Support for device rework - BGA rework compatible For more details, please contact us or download the catalog.
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basic information
【Case Study】 [Requesting rework of BGA that failed at another company] We received a request for rework of a BGA that failed at another company and completed the work without any issues. * Based on our technology and equipment capabilities, we often receive various requests from other companies in the same industry. * We also handle BGA rework, reballing, underfill rework, high-difficulty modifications, LGA implementation and rework, PoP rework, and more. * There are many requests for rework only from other companies in the same industry or their end-users. 【Supporting companies with such concerns】 ○ Have an assembly line but lack rework equipment ○ Requested rework from another company but were turned down ○ Implemented BGA but cannot verify due to lack of X-ray inspection equipment ● For more details, please contact us or download the catalog.
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Company information
Our company was founded in 1990 with four members. At the time of our establishment, we had no equipment, and each of us primarily worked on renovation projects and manual assembly with just a soldering iron. As the miniaturization of components progressed and the number of prototype and development projects involving BGA increased, so did the demand for BGA reballing and jumper wiring. Therefore, we introduced BGA rework equipment before implementing basic devices such as reflow ovens. Since then, we have conducted extensive research in technology alongside numerous customers, and we take pride in having established a level of reliability that satisfies our clients, not only for BGA but also for LGA, POP, underfill applications, and 0402 chip mounting. Other features of our company include the establishment of a RoHS-compliant factory, maintaining a constant inventory, and providing mounting support for cut parts (My Data), which differentiates us from other companies in the same industry. It is our mission to respond to all QCD (Quality, Cost, Delivery) requirements necessary for development and prototype assembly, and we are committed to providing technical support with customer satisfaction as our top priority.