I want to change the composition from lead-free solder balls to eutectic solder balls! We will solve your concerns about solder composition changes!
In the composition change of K-All's solder, we will switch from lead-free balls to eutectic balls. If the solder specifications of the substrate and the solder balls of the BGA differ, unexpected troubles may arise. K-All also conducts work to prevent implementation troubles by removing solder with different specifications and then attaching solder balls that match the specifications. We propose a reliable method while making use of your existing BGA. 【Features】 ○ Specification change from lead-free balls to eutectic balls ○ Preventing implementation troubles in advance through composition changes ○ Proposing a highly reliable method For more details, please contact us or download the catalog.
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【Case Examples】 [We want to change the composition from Pb-free solder balls to eutectic solder balls] ○ We have a track record from 1 piece to 10K The finished state is within the specified standards. * We have experience changing from eutectic solder balls to Pb-free solder balls. When changing from eutectic solder balls to Pb-free solder balls, the customer conducted an analysis investigation. * If the heat resistance temperature of the device is lower than the melting temperature of Pb-free solder, there is a risk of device damage. * We have a large stock of metal masks and solder balls (φ0.76mm to 0.25mm, Pb-free, eutectic) with pitch sizes from 1.27mm to 0.4mm. [We want to reball during BGA rework] ○ Reballing occurs for failure analysis, with many cases where failure is not an option. * With over 30 years of reballing experience, we pride ourselves on a 99% reballing success rate. * Cream solder is used at the joint between the ball and the substrate, and we have gained trust exceeding product standards regarding strength. * Basically, reballing is performed using cream solder. ● For more details, please contact us or download the catalog.
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Company information
Our company was founded in 1990 with four members. At the time of our establishment, we had no equipment, and each of us primarily worked on renovation projects and manual assembly with just a soldering iron. As the miniaturization of components progressed and the number of prototype and development projects involving BGA increased, so did the demand for BGA reballing and jumper wiring. Therefore, we introduced BGA rework equipment before implementing basic devices such as reflow ovens. Since then, we have conducted extensive research in technology alongside numerous customers, and we take pride in having established a level of reliability that satisfies our clients, not only for BGA but also for LGA, POP, underfill applications, and 0402 chip mounting. Other features of our company include the establishment of a RoHS-compliant factory, maintaining a constant inventory, and providing mounting support for cut parts (My Data), which differentiates us from other companies in the same industry. It is our mission to respond to all QCD (Quality, Cost, Delivery) requirements necessary for development and prototype assembly, and we are committed to providing technical support with customer satisfaction as our top priority.
