What we pursue is "high precision" and "processing that does not stress the material."
At Mikata Co., Ltd., we propose a resin cutting process that allows for stress-free extraction of resin films. When processing adhesive materials and wrapping them, there can be adhesive overflow from the side of the adhesive material (cut surface) as it approaches the paper tube (core) section. However, we have successfully implemented a wrapping technique that prevents overflow. 【Features】 ■ Almost no adhesive overflow occurs during the cutting process with our stress-free method. ■ Achieves a cross-section with almost no burrs. *For more details, please contact us or download the catalog.
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There are various types of double-sided tape processing. "What will you be attaching?" "What size do you need?" "Are you considering recycling?" "Is waterproofing necessary?" "Are there any thickness restrictions?" "Do you need heat resistance, durability, or light resistance?" Please feel free to consult us about anything.