This is a material developed to address challenges such as "high thermal conductivity, metal adhesion, low-temperature curing, and low-pressure molding." We can provide proposals that include customization.
"Epoclustar Coolie" is a solid sealing material developed for transfer molding based on epoxy resin. It is a custom material unique to our company, designed for semiconductor, motor, and coil sealing applications. 【Achievements】 - High thermal conductivity grades (1–6 W/m·K) - Metal adhesion properties (Ni, Al, Au, Cu, Ag, etc.) - Grades suitable for thin-walled molding *The catalog includes representative grades. We can also propose materials outside of the catalog depending on your application, so please feel free to contact us.
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Line up（4）
| Model number | overview |
|---|---|
| MMM17/MSW1305 | High thermal conductivity grade with insulation |
| YA7500/YA5075 | High adhesion grade ※The above is a representative grade. Other proposals will be made depending on the adhesion target, so please contact us first. |
| YA1020LCW/RFS10-2 | Grade for filling in narrow areas |
| YS06818 | Low temperature molding grade (130℃~) |
catalog（1）
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■ Changing the Concept of Resin Products Changing conventional wisdom and transforming the concept of resin products. We challenge the resinization of all products by pursuing new possibilities in resin technology. ■ Resin Product Coordinator We provide comprehensive support for all processes from the design to the production of our customers' resin products. We propose optimal resin products from every angle. ■ Customization of Resin Materials Through our unique compound technology, we enhance various types of resins for high functionality. We match products to high value-added specifications according to required characteristics. ■ Consistent Production of Resin Products Using resin composite materials as the core, we offer high-quality resin products through a consistent technology and production system that encompasses mold making, molding, and post-processing.