[Analysis Case] Evaluation of the Fracture Surface of Laminated Samples by AES Analysis
Visualizing a 50nm thin film with a cross-sectional sample.
AES analysis is a method for obtaining compositional information from the surface to a depth of several nanometers. By performing AES measurements on the cross-section of a sample to obtain elemental distribution images, it is possible to clearly evaluate the layered structure. In addition to evaluating layered structures and conducting elemental analysis of the inner walls of trenches and holes, combining mechanical processing and ion beam processing allows for the assessment of thin alloy layers and phenomena such as diffusion and segregation of elements. In this case, we will present data evaluated using AES analysis for a thin film deposited on a silicon substrate.
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Analysis of LSI, memory, electronic components, manufacturing equipment, and parts.
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MST is a foundation that provides contract analysis services. We possess various analytical instruments such as TEM, SIMS, and XRD to meet your analysis needs. Our knowledgeable sales representatives will propose appropriate analysis plans. We are also available for consultations at your company, of course. We have obtained ISO 9001 and ISO 27001 certifications. Please feel free to consult us for product development, identifying causes of defects, and patent investigations! MST will guide you to solutions for your "troubles"!