Technical Introduction: "Improvement of Shape Accuracy (High-Density and Fine Processing Technology)"
Introducing technology for improving shape accuracy! High-precision shape processing tailored to patterns is possible.
At Sato-Sen Co., Ltd., we have achieved a positional accuracy of ±50μm in outline and pattern positioning. For pattern formation, we utilize the LDI (Laser Direct Imaging) method, and for outlines, we can perform high-precision outline processing tailored to the pattern using CCD technology. We improve hole position accuracy with ultra-high-speed micro-diameter drill machines, form high-density circuits (L/S = 30/30) with LDI, and provide high-density multilayer printed circuit boards with stable quality using X-ray reference drilling devices and X-ray length measuring machines. 【Features】 ○ We offer multilayer printed circuit boards → High density, IVH, BVH, and build-up with design flexibility ○ Implementation on through-holes is possible with flat plugs (pad-on-via) ○ Support for narrow pitch patterns with landless through-holes ○ Extremely fine printing is possible (1 character: vertical 0.28mm × horizontal 0.15mm) Please contact us for more details.
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basic information
**Technical Introduction** ○ Circuit Formation → Achievements up to ±30μm ○ Bonding Gold Plating → Over 25 years of achievements in COB substrates ○ Bonding Silver Plating → Capable of electroplating silver without electricity ○ Encapsulation Resin Leakage → Possible to prevent resin leakage by permanently filling holes with epoxy ○ Dimensional Accuracy → Achievements up to ±50μm ○ V-Cut Position Accuracy → Achievements up to ±50μm ○ Counterboring → High-precision counterboring processing is possible ○ High Frequency → Impedance matching as per request is possible, reducing noise ○ LED Brightness → Reflectivity can be improved through substrate, plating, and solder resist ○ Heat Dissipation → Heat dissipation is possible through pattern design, selection of heat-dissipating materials, and setting conductor thickness ○ Miniaturization → Miniaturization with integrated rigid-flex printed circuit boards ○ Mounting → Easy-to-mount pattern design implemented at the design stage ○ Magnetism → Magnetism can be reduced by selecting nickel plating solutions ○ Dust Prevention → Achievements in mass production for optical systems through optimization of router programs and dust collection technology during and after processing ● For more details, please contact us.
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Company information
Sato-sen Co., Ltd. provides high-quality printed circuit boards that meet the increasing demands for high functionality and high precision, by proposing solutions to the concerns and problems of those involved in design, development, technology, and purchasing. Sato-sen offers customized, high-quality products and services tailored to various customer needs. As a partner company for our customers, Sato-sen delivers high added value throughout all processes, from design and development to production and delivery. Furthermore, by thoroughly adhering to a customer-first principle, we provide high-quality products and services with flexible and meticulous responsiveness, ensuring that customers receive what they want, when they want it.
![[Example of Printed Circuit Board Manufacturing] Build-up Board](https://image.mono.ipros.com/public/product/image/589/2001120579/IPROS45534754416742640010.png?w=280&h=280)
