Making possible what was impossible with etching processing! A processing technology with a wide range of applications.
Hirai Precision Industry Co., Ltd. offers adhesive processing and machining that can accommodate semiconductor package components as part of composite processing. Among these, machining is a processing technology capable of addressing areas that cannot be covered by etching processing. By introducing CO2 laser processing machines and wire electrical discharge machines, we have made it possible to cut and drill metals, plastics, ceramics, and other materials that are impossible to process with etching. Additionally, we can perform processing that combines etching with laser and wire electrical discharge, as well as reprocessing of ready-made products, providing a wide range of applications. [Features] ■ Processing that was impossible with etching is now possible ■ Wide range of applications *For more details, please refer to our catalog or feel free to contact us.
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【Machining Contents】 ■ Laser processing ■ Wire electrical discharge machining ■ Precision press processing ■ Spot welding (resistance welding) ■ Thermal pressing and diffusion bonding processing, etc. 【Adhesive Processing Technology】 ■ Attachment processing of various substrates + heat spreaders ■ Attachment processing of lead frames for QFN and polyimide tape ■ Attachment processing of adhesive sheets for semiconductor packages *For more details, please refer to the catalog or feel free to contact us.
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For more details, please refer to the catalog or feel free to contact us.
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With a motto of small lots, diverse varieties, and short delivery times, we provide high-quality products through a consistent production system from prototype processing to mass production. We offer various proposals from the development stage of semiconductor packages and meet the needs of over 1,000 customers both domestically and internationally through precision processing technology. We aim to be a "department store of processing technology" that can handle all precision processing, primarily focusing on etching, including essential transport tools and carriers used in the manufacturing processes of semiconductors and electronic components.
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