Foundation technology advantageous for miniaturization of modules!
Ceramic processing is a processing technology that uses glass-ceramic substrates with a thermal expansion coefficient close to that of silicon. Glass-ceramic substrates can be fired at temperatures below 1000°C, allowing the use of Ag, AgPd, and Au as internal conductors. Additionally, since the dielectric constant is lower than that of alumina substrates, signal delay is also minimized. The thermal expansion coefficient being close to that of silicon makes direct die bonding and flip chip (FC) connections to the substrate easier. 【Features】 - Advantageous for miniaturization of modules - Direct die bonding and flip chip (FC) connections to the substrate are easy *For more details, please refer to the catalog or feel free to contact us.
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【Summary】 Glass-ceramic substrates can be fired at temperatures below 1000°C, allowing the use of Ag, AgPd, and Au as internal conductors. They have a lower dielectric constant than alumina substrates, resulting in reduced signal delay. Additionally, they have a thermal expansion coefficient close to that of silicon, making direct die bonding and flip chip (FC) connections easy. *For more details, please refer to the catalog or feel free to contact us.*
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For more details, please refer to the catalog or feel free to contact us.
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With a motto of small lots, diverse varieties, and short delivery times, we provide high-quality products through a consistent production system from prototype processing to mass production. We offer various proposals from the development stage of semiconductor packages and meet the needs of over 1,000 customers both domestically and internationally through precision processing technology. We aim to be a "department store of processing technology" that can handle all precision processing, primarily focusing on etching, including essential transport tools and carriers used in the manufacturing processes of semiconductors and electronic components.