Pattern exposure at matching positions on the front and back of samples with different processes! Nanotech exposure equipment.
The mask alignment exposure device "BA Series" for backside alignment of samples is a low-cost mask alignment device that enables alignment from the backside of the sample, which was difficult with conventional exposure devices. This device allows for alignment and exposure of the mask pattern to a specified position on the opposite side (the second side) relative to the alignment mark pre-formed on the first side of the sample. Its compact design also allows it to be used as a standard single-sided exposure mask aligner, supporting the development of various MEMS and semiconductor devices with double-sided features. 【Features】 ■ Equipped with a dual-objective 2-field CCD microscope dedicated to backside observation ■ Minimum objective lens spacing of 16mm ■ Capable of aligning small samples ■ Equipped with a freeze-wipe processing device optimized for backside alignment ■ High-precision alignment stage with front slide for convenient sample access, among others *For more details, please refer to the catalog or feel free to contact us.
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【Specifications】 ■ Alignment Method - Video memory alignment by observing the back or front surface of the mask sample ■ Exposure Method - 1.1 (1x) contact exposure ■ Applicable Samples - Maximum size: BA100φ4 inches, BA160Φ6 inches ■ Applicable Masks - Maximum size: BA100□5 inches, BA160□7 inches ■ Alignment Stage - Mask fixed, sample moved *For more details, please refer to the catalog or feel free to contact us.
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