Pattern exposure at matching positions on the front and back of samples with different processes.
The BA series backside mask alignment exposure device is a low-cost mask alignment system that enables alignment from the backside of the sample, which was difficult with conventional exposure devices. It can also be used as a standard single-sided exposure mask aligner, supporting the development of various MEMS and semiconductor devices with double-sided configurations. This device allows for the alignment and exposure of mask patterns to specified positions on the opposite side (the second side) of the sample, relative to pre-formed alignment marks on the first side. For more details, please contact us or refer to the catalog.
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【Features】 ○ Equipped with a dual-objective 2-field CCD microscope designed specifically for back-side observation ○ Minimum objective lens spacing of 16mm allows for alignment of small samples ○ Equipped with a freeze-wipe processing device optimized for back-side alignment (image memory) ○ High-precision alignment stage with front slide for convenient sample access ○ Compact and highly versatile, can also be used as a standard single-side exposure device 【Main Specifications】 ○ Alignment Method → Video memory alignment through observation of the back or front side of the mask-sample ○ Exposure Method: 1.1 (1x) contact exposure ○ Applicable Samples: Maximum size BA100φ4 inches, BA160Φ6 inches ○ Applicable Masks: Maximum size BA100□5 inches, BA160□7 inches ○ Alignment Stage: Mask-fixed/sample-moving method ● For more details, please contact us or refer to the catalog.
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