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  1. Home
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  3. Scientific and Physics Equipment
  4. Surface Treatment Equipment
  5. Plasma surface treatment equipment
  6. Atmospheric pressure plasma surface treatment device for 5G printed circuit boards (FCCL) as well.

Atmospheric pressure plasma surface treatment device for 5G printed circuit boards (FCCL) as well.

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last updated:Mar 14, 2023

イー・スクエア
イー・スクエア
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Direct adhesion with films such as liquid crystal polymers, fluororesins, and PP, as well as with dissimilar materials is possible. *Materials comparing the differences with corona, light, and wet methods will be provided.

Our atmospheric pressure plasma surface treatment device, "Precise," features a plasma generation unit that is separated from the treatment area (downstream type), allowing for the application of functional groups and hydroxyl groups to the surface through molecular bonding without damaging the treatment side. This enables direct adhesion to liquid crystal polymers (LCP) and fluororesins while maintaining a smooth surface. Additionally, by activating the surfaces of the positive and negative electrode parts and separators through plasma treatment, we can expect a reduction in the impregnation time for electrolyte injection into lithium-ion batteries. For more details, please contact us or download the catalog.

    Plasma surface treatment equipment
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Atmospheric pressure plasma surface treatment device for 5G printed circuit boards (FCCL) as well.

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  • Related Link - http://www.e2-square.co.jp/

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basic information

Regarding the reduction of injection time for electrolyte into lithium-ion batteries, by making the surface of the work hydrophilic, the effect of capillary action can be enhanced, which is expected to shorten the injection time of the electrolyte. If you are interested, we would be grateful if you could contact us.

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Atmospheric Pressure Plasma "Precise" Series

Atmospheric Pressure Plasma "Precise" Series

TECHNICAL
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Plasma surface treatment device "AP Plasma Precise II"

Plasma surface treatment device "AP Plasma Precise II"

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[Data] Advantages of Atmospheric Pressure Plasma Surface Modification and Its Equipment ver: 2

[Data] Advantages of Atmospheric Pressure Plasma Surface Modification and Its Equipment ver: 2

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Direct bonding and adhesive-free bonding in a downstream type.

Direct bonding and adhesive-free bonding in a downstream type.

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Exhibiting at the 6th Next Generation Infrastructure Technology Industry Exhibition TECH Biz EXPO 2016!

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We are pleased to introduce our atmospheric pressure plasma device for sizing surface treatment. On November 18 (Friday) from 13:55 to 14:15, our representative Takashima will give a presentation. Theme: "High-speed Hydrophilization Treatment of Carbon Fiber Surfaces Using Atmospheric Pressure Plasma" We hope you will attend. Exhibition period: November 16-18, 2016, from 10:00 to 17:00 Venue: Fukiyama Hall (Nagoya Small and Medium Enterprise Promotion Center) Address: 2-6-3 Fukiyama, Chikusa Ward, Nagoya City

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イー・スクエア

イー・スクエア

Electronic Components and Semiconductors

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We are expanding a new approach using dry processes to leverage the reliability of our equipment and various know-how cultivated through sales performance, applying its advantages to other markets (such as the battery market and particles) alongside process applications. Our downstream-type high-density plasma source (electrode) processing section is isolated from the workpiece, preventing any electrical or physical damage to the workpiece, and eliminating the effects of ultraviolet light generated during plasma creation. This allows for the only clean processing (particle-free) possible with atmospheric pressure plasma equipment. By changing the added gases, we can selectively impart molecular functionality, enabling interface control according to various surface materials as a processing technology. This is an effective means for direct adhesion, adhesion of dissimilar materials, and enhancing the adhesion of stronger coatings. The processing width (plasma width) can uniformly handle from 100mm to 3000mm. We can also accommodate carbon fiber bundles and fiber bundle shapes, allowing for uniform processing even within the bundles. Additionally, we can handle the same processing for particles. We manufacture tabletop experimental devices of the downstream type, conduct spot-type device experiments (starting from 2.5 million yen), and also carry out on-site experimental sample work.

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