Customization is possible according to your needs! For the evaluation of warpage and deflection of wafers and flat panels.
The "Dyvoce Series" is a non-contact shape measurement system that uses laser displacement sensors tailored to the workpiece being measured. Equipped with features that prioritize ease of use and a simple user interface, it offers high reliability and motion control technology unique to high-precision stage manufacturers, enabling various measurements. For stage sizes (measurement areas) not listed in the lineup, customization is available according to your application. Please feel free to contact us when needed. 【Features】 ■ Well-suited for evaluating warpage and deflection of wafers and flat panels ■ Equipped with features that prioritize ease of use and a simple user interface ■ Custom holders can be made to fit the workpiece ■ We accept customer samples for pre-installation test measurements ■ It is also possible to try actual measurements *For more details, please refer to the PDF materials or feel free to contact us.
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basic information
**Functions** ■ Measurement Drive - Dyvoce Measure (Shape Measurement Software) - Spider Measure (Thinning Measurement) - GridMaker (Bulk Measurement of Multiple Works) ■ Analysis - DyvoceAnalyzer (Analysis Software) - SORI・BOW (SEMI Standard) - Report Creation ■ Analysis (Optional) - Mapping Correction - Self-weight Deflection Correction *For more details, please refer to the PDF materials or feel free to contact us.*
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Applications/Examples of results
【Purpose】 ■ Evaluation of warpage and deflection of wafers and flat panels *For more details, please refer to the PDF document or feel free to contact us.
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We offer a full range of positioning solutions required for nano-level high-precision positioning, image processing alignment, semiconductor inspection, optical device assembly, and automotive camera production.