Ideal for precision joining experiments such as micro work and thin material bonding. The waveform during joining is output via a BNC terminal, allowing monitoring by connecting external devices.
Equipped with the vibration system of the REBO series wire bonder, it supports spot welding. Monitoring of four types of waveforms during welding is possible. Note: Measurement devices such as oscilloscopes are required for monitoring. It achieves a lower pressure setting compared to air press type metal joining machines (compared to our company). The joining horn uses interchangeable tools, allowing access to deep workpieces (approximately 58 mm from the horn to the tool tip). The Z-axis lifting stroke is approximately 20 mm. External control via PLC enables integration into automated systems and repurposing for mass production machines.
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basic information
Model: Metal-80 Output: Approximately 94W Frequency: 80kHz Pressure: Approximately 10 to 60N External Output: Transducer current waveform, frequency relative displacement waveform, transducer voltage waveform, subsidence waveform (with monitor connector)
Price range
P5
Delivery Time
Applications/Examples of results
Joining of lithium-ion battery tabs Joining of copper laminated foil and aluminum laminated foil Ribbon wire bonding Interconnection of 18650 batteries
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Company information
Since our founding, we at Ultrasonic Industry have been engaged in technology-driven management by combining our core ultrasonic technology with electronics and, further, mechatronics technology. We have received generous evaluations of our technological and product development capabilities from many, and we sincerely thank you for your support. In today's market, which is diversifying and where product life cycles are becoming increasingly shorter, what is required of companies is high development capability and rapid responsiveness born from flexible thinking. To provide products with high performance at low cost, we will further enhance our internal and external networks and aim to be a nimble company. Moreover, Ultrasonic Industry will play its role as a leading company in the industry in the highly information-oriented era of the 21st century, enhancing the development and technical capabilities we have cultivated thus far, and further refining our creativity by leveraging the individuality of each employee as we move forward with renewed determination. In the future, we will actively expand our business in the semiconductor manufacturing sector, industrial equipment sector, and measurement equipment sector, while flexibly responding to the needs and seeds of society, and we are committed to contributing to the creation of a prosperous society. We sincerely ask for your continued guidance and support.
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