With the experimental equipment available, ideal metal bonding can be achieved through solid-phase joining using ultrasonic vibrations, resulting in a clean and low-loss process.
The fully automatic ultrasonic metal bonder "REBO-Metal-S2" achieves optimal bonding conditions for various workpieces (such as power module terminal sections, bus bars, and metal foils) through a variety of oscillation triggers. It is equipped with X, Y, Z, and θ axes, allowing for automatic recognition and bonding at any desired point. 【Features】 ○ Achieves clearance for bonding power module terminal sections by adopting a tool-type horn. ○ Bonding tools can be easily replaced with a single screw. ○ Capable of saving and evaluating waveform data for all bonding points. ○ Bonding conditions can be set for each bonding point. ○ Equipped with X, Y, Z, and θ axes, allowing for automatic recognition and bonding at any desired point.
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basic information
【Specifications】 ○ Model: USW-3021G6-RS ○ Bonding range: Inside Φ380mm ○ Rated output: 3000W ○ Frequency: 21kHz ○ Required power supply: Three-phase 200V±10% (50/60Hz) 5000VA ○ External dimensions (mm): 1100 (width) × 1450 (depth) × 1950 (height) mm → Excluding monitor, signal tower, and protrusions ● For more details, please contact us or download the catalog.
Price information
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Delivery Time
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Applications/Examples of results
◇Power module terminal section ◇Bus bar ◇Metal foil
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Company information
Since our founding, we at Ultrasonic Industry have been engaged in technology-driven management by combining our core ultrasonic technology with electronics and, further, mechatronics technology. We have received generous evaluations of our technological and product development capabilities from many, and we sincerely thank you for your support. In today's market, which is diversifying and where product life cycles are becoming increasingly shorter, what is required of companies is high development capability and rapid responsiveness born from flexible thinking. To provide products with high performance at low cost, we will further enhance our internal and external networks and aim to be a nimble company. Moreover, Ultrasonic Industry will play its role as a leading company in the industry in the highly information-oriented era of the 21st century, enhancing the development and technical capabilities we have cultivated thus far, and further refining our creativity by leveraging the individuality of each employee as we move forward with renewed determination. In the future, we will actively expand our business in the semiconductor manufacturing sector, industrial equipment sector, and measurement equipment sector, while flexibly responding to the needs and seeds of society, and we are committed to contributing to the creation of a prosperous society. We sincerely ask for your continued guidance and support.
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