High-speed servo pressure control and high-rigidity rigid mechanism, ultrasonic metal joining machine USDB.
Uthe Servo Drive Bonder 35kHz / 20kHz
The astonishing repeatability of processing accuracy achieves quality improvement. We provide an easy-to-understand joining logic (waveform data and parameter settings). Comparisons and evaluations are welcome.
The ultrasonic metal bonding machine 'USDB' is an ultrasonic metal bonding machine that achieves high-speed cycle operation, high-speed data transfer, and high-precision position control. The servo motor press pressure control with a one-axis rigid structure realizes ultra-fine position accuracy and high-speed load tracking, providing stable ultrasonic energy addition and dramatically improving processing reproducibility. The new Ethernet/IP connection simplifies the operation management of automated lines and converts all bonding results into big data. 【Features】 - Processing assembly accuracy, operational precision, and ultrasonic control that ensure the ultrasonic vibration energy during bonding is reliably transmitted to the workpiece. - High reliability in position accuracy (1µm) achieved through the rigidity of the distinctive one-piece frame structure. - Original program that realizes high-speed load tracking (stable load) against load fluctuations during bonding. - Easy setting operations enabled by the simple screen MMI (man-machine interface) with a color touch panel. - Unique ultrasonic control method for applications sensitive to frequency and impedance fluctuations. - Protective circuit program included to prevent failures of the ultrasonic oscillator and servo due to overloads. - Excellent bonding reproducibility that allows for easy reading of processing behavior from bonding data waveforms and performing multiple regression analysis of the data.
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basic information
■Other Features - Adoption of a peeling oscillation program that can be set according to the joining condition - Standard modes prioritizing ease of use for evaluation tasks and high-speed cycle operation for continuous tasks - Capability for automation equipment and program adaptation according to user needs ■Main Specifications - 20kHz-3000W, 35kHz-900W - Load range 100N to 3000N For detailed specifications, please contact us separately. ■Proven Joining Combinations - Wire + Wire (0.35sq to 5.5sq) - Wire + Plate (0.35sq to 40sq, t0.2mm to t3mm) - Plate + Plate (t0.2mm to t3mm) - Foil + Foil (Plate) (@t6µm to t13µm × N) Main joining materials include aluminum, copper, nickel, etc., depending on specifications. Please consult us for other joining products. ■Ultrasonic Joining Consulting We conduct experimental evaluations in response to various joining requests from customers. We hope to assist in product development by providing insights from our ultrasonic studies based on joining experiments. Comparisons with other companies' equipment currently in use or under consideration by customers are also welcome. We also offer lectures on ultrasonic harness joining for electric vehicles. Please feel free to contact us.
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Applications/Examples of results
*For more details, please feel free to contact us. ■Applications - Ultrasonic metal joining of semiconductor components - Joining of automotive harness wires and busbars - Joining of laminated foils and tabs for secondary batteries ■Proven Joining Combinations - Wire + Wire (0.35sq to 5.5sq) - Wire + Plate (0.35sq to 40sq, t0.2mm to t3mm) - Plate + Plate (t0.2mm to t3mm) - Foil + Foil (Plate) (t6µm to t13µm × N) The main joining materials include aluminum, copper, nickel, etc., depending on specifications. Please consult us regarding other joining products.
Line up（3）
| Model number | overview |
|---|---|
| USDB-AGM20kHz | Supports a maximum load of 3000N and a maximum output of 3000W |
| USDB-AGM35kHz | Supports a maximum load of 700N and a maximum output of 900W |
| SSTG35kHz-900W | RINCO manufactured servo-type ultrasonic metal welding machine |
catalog（1）
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Company information
UC Technology Inc. (USA) has been at the forefront of ultrasonic technology since 1966, advancing alongside semiconductor manufacturing equipment. After establishing UC Japan Co., Ltd. in 1990, we developed strong relationships with major semiconductor manufacturing equipment manufacturers in Japan, primarily focusing on OEM supply for numerous wire bonders and flip chip bonders, building trust and a solid track record. Since 2005, we have collaborated with our sister companies, including Lincos (Switzerland), Artec (Switzerland), Crest (USA), Martin Walter (Germany), and KLN (Germany), and have also begun handling various ultrasonic applications. To support global efforts to address environmental and energy issues, we prioritize meeting requirements such as efficiency, lightweight design, miniaturization, strength, airtightness, and reproducibility. We value experimental verification with our customers and continuously propose ultrasonic solutions necessary for creating the future of manufacturing. Please feel free to consult with us.
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