Compatible with a variety of materials! Creates a shining mirror finish!
Our polishing process not only selects the appropriate polishing materials for each type of material (ceramics, tungsten, and other metals) but also utilizes our advanced processing technology to achieve surface characteristics that meet our customers' requirements. 【Our Strengths】 ◇ Ultra-high precision flatness ◇ Surface roughness Ra 10–20nm ◇ Dimensional accuracy: We accommodate all general tolerances from rough to fine grades, and can also handle ±5μm depending on the product shape. *For more details, please refer to our catalog or feel free to contact us.
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basic information
【Main Equipment】 ■ Lapping Machines ・ Flat Lapping Machine ・ Double-Sided Lapping Machine ■ Polishing Machines ・ Tin Plate (with Facing Mechanism and Spiral Groove Processing Device) ・ Copper Plate ・ Polishing Cloth ■ Cleaning Machines ・ Ultrasonic Cleaning Machine ・ Automatic Workpiece Cleaning Machine ・ Automatic Wax Cleaning Machine *For more details, please feel free to contact us.
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For more details, please refer to the catalog or feel free to contact us.
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Company information
Since our establishment, we have been cultivating flat grinding technology for over 40 years. We are capable of lapping and mirror polishing various materials, including semiconductor ceramic wafers, difficult-to-cut materials (such as tungsten and stainless steel), and other metal materials. We also have a track record of regenerating and polishing mechanical seals. Additionally, we accommodate single-item processing and small-lot, diverse production. Please feel free to contact us for more information.