川本研磨 Company Profile

Specialist in precision flat grinding. Leave semiconductor wafer and various metal grinding to us.

Since our establishment, we have been cultivating flat grinding technology for over 40 years. We are capable of lapping and mirror polishing various materials, including semiconductor ceramic wafers, difficult-to-cut materials (such as tungsten and stainless steel), and other metal materials. We also have a track record of regenerating and polishing mechanical seals. Additionally, we accommodate single-item processing and small-lot, diverse production. Please feel free to contact us for more information.