Micro hole processing with a hole diameter of φ0.05mm or larger / High precision hole processing with φ0.05mm and a tolerance of ±5μm (aspect ratio 1.0) using pressing.
【Features】 - High-precision hole processing with a diameter of φ0.05mm and a tolerance of ±5μm (aspect ratio 1.0) Material: Stainless steel Thickness: 0.05mm Application: Gas sensor components In the precision parts division of Misuzu Industry, we utilize the technology of press processing for ultra-small and thin parts, developed through the manufacturing of watch components, to perform fine and complex shapes that were previously impossible with conventional pressing, including punching, bending, and drawing. Our integrated manufacturing system, from mold design and production to pressing and surface treatment, enables us to achieve micron-level shape and precision orders from customers, meeting diverse needs. *For more details, please contact us directly.
Inquire About This Product
basic information
【Material】 Stainless steel 【Thickness】 0.05mm 【Usage】 Gas sensor components
Price range
Delivery Time
Applications/Examples of results
Gas sensor component
catalog（1）
Download All Catalogs
Company information
In the precision parts business, we have achieved the processing technology for ultra-small and thin parts through press processing (metal and non-metal) developed in the manufacturing of watch components, along with a consistent in-house manufacturing system that encompasses mold design and production, press processing, and surface treatment. This allows us to realize fine and complex shapes that were previously considered impossible with conventional pressing, including cutting, bending, and drawing techniques. We shape micron-order geometries and precision while responding to our customers' diverse needs. In the precision assembly business, we leverage our long-standing high-precision and high-density bare chip mounting technology, primarily focusing on reel-to-reel FPC mounting, enabling us to provide consistent support from dicing to final testing and sub-assembly.