High-efficiency surface modification of CFRP and long fiber bundles using atmospheric pressure plasma devices.
Precise Series
Surface treatment of CFRP, fiberglass, and long fibers.
The Atmospheric Pressure Plasma Device Precise Series is based on nitrogen gas and utilizes dielectric barrier discharge to isolate the workpiece from the electromagnetic field area, using only the radicals excited within the reactor. This allows for continuous processing without damaging the workpiece. Additionally, even when the workpiece is charged, it is discharged during processing, and there is no particle adhesion in the air after treatment. By changing the added gas, it is possible to select bonding molecules such as functional groups, OH groups, and amine groups on the treated surface, enabling optimization of bonding conditions in the next process. For more details, please contact us or download the catalog.
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basic information
**Advantages of Atmospheric Pressure Plasma Surface Modification** - No need for a drying process due to dry treatment (dry process) - Can treat all areas of active gas (various radicals) intrusion - The equipment is compact (space-saving) - No physical damage to the treated surface (downstream type) - No charging after treatment (downstream type) - No change in device performance even when treating semiconductor devices - No UV damage to the surface during treatment - No particle generation (downstream type) - Surface drying without residue formation - Efficient dry cleaning can be achieved deep within fiber bundles due to high-density radical generation - By changing the type of added gas, it is possible to select functional groups or amine groups suitable for the matrix material - Joining technology for similar and dissimilar materials through interface control
Price information
The price of the device changes with the plasma length. By increasing the plasma length, the processing speed can be accelerated. Please contact us. We are currently manufacturing tabletop experimental machines (width from 100mm) and conducting sample work.
Delivery Time
※Please contact us.
Applications/Examples of results
●Improved adhesion to matrix materials ●Enhanced coating performance ●Reduction treatment of copper wire surface
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Company information
We are expanding a new approach using dry processes to leverage the reliability of our equipment and various know-how cultivated through sales performance, applying its advantages to other markets (such as the battery market and particles) alongside process applications. Our downstream-type high-density plasma source (electrode) processing section is isolated from the workpiece, preventing any electrical or physical damage to the workpiece, and eliminating the effects of ultraviolet light generated during plasma creation. This allows for the only clean processing (particle-free) possible with atmospheric pressure plasma equipment. By changing the added gases, we can selectively impart molecular functionality, enabling interface control according to various surface materials as a processing technology. This is an effective means for direct adhesion, adhesion of dissimilar materials, and enhancing the adhesion of stronger coatings. The processing width (plasma width) can uniformly handle from 100mm to 3000mm. We can also accommodate carbon fiber bundles and fiber bundle shapes, allowing for uniform processing even within the bundles. Additionally, we can handle the same processing for particles. We manufacture tabletop experimental devices of the downstream type, conduct spot-type device experiments (starting from 2.5 million yen), and also carry out on-site experimental sample work.