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  6. Introduction to 3D Photolithography Processing Technology

Introduction to 3D Photolithography Processing Technology

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last updated:Nov 12, 2020

フォトプレシジョン
フォトプレシジョン
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Processing technology using "electrolytic plating"!

"3D Photolithography" is a processing technology that can uniformly form a resist film on any conductive surface. It was developed using "electroplating," which involves immersing the entire substrate in a liquid phase to deposit a metal film. This technology enables photolithography processing to be applied to the entire three-dimensional shape, including edges and corners. [Features] - Uniform formation of resist film on any conductive surface - Utilizes "electroplating" - Photolithography processing possible on the entire three-dimensional shape, including edges and corners *For more details, please refer to the catalog or feel free to contact us.

    Technology Development
『三次元フォトリソ』加工技術紹介.JPG

Introduction to 3D Photolithography Processing Technology

『三次元フォトリソ』加工技術紹介.JPG
『三次元フォトリソ』加工技術紹介.JPG
  • Related Link - http://www.photopre.co.jp/technology/3dphoto.html

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【Product Overview】 Electrolytic plating is suitable for processing three-dimensional shapes as it forms a metal film by immersing the substrate in a liquid phase. For example, it can be used for processes such as through-hole conduction, which allows for electrical connection on both sides of a substrate with holes. As a metal film, it is used for circuit formation where film thickness is required and as a sacrificial layer for lift-off. Additionally, it is possible to create fine bumps by raising part of the pattern. *For more details, please refer to the catalog or feel free to contact us.*

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Introduction to 3D Photolithography Processing Technology

Introduction to 3D Photolithography Processing Technology

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フォトプレシジョン

フォトプレシジョン

Manufacturing and processing contract

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Photo Precision Co., Ltd. is a company that contributes to prototyping and development in various fields, including microelectronics and optical products, with photofabrication as its core technology. Next-generation industrial core products such as MEMS (Micro Electro Mechanical Systems), biochips, and microchemical chips are formed by the complex application of technologies such as nanotechnology, three-dimensional micromachining, high-density three-dimensional packaging, and three-dimensional photolithography. Photofabrication is deeply involved in all of these technologies and serves as the foundational technology for MEMS development. We strive for continuous technical improvement with the support of our customers, while also introducing advanced equipment as much as possible to meet the diverse needs of our clients.

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