Characteristics List of Copper-Clad Laminates and Multilayer Substrate Materials for Printed Circuit Boards
List of printed circuit board materials, copper-clad laminates, and multilayer board materials.
The "Copper Clad Laminates and Multilayer Substrate Materials Characteristics List" presents a table of characteristics such as "Glass Epoxy," "High Tracking Resistance Glass Epoxy," and "High Reliability Halogen-Free Glass Epoxy." Additionally, it includes the UL certification values for printed circuit board materials. *For more details, please refer to the catalog or feel free to contact us.
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What is ASTIC? We use the initials of the product categories we handle. We offer a total of five categories for sale. A (Alloy) Supply of heating wire materials and various heater units (General heaters) Various metal materials S (Sensor) Thermostats, temperature fuses, current fuses, thermistors, etc. (Wako Electronics, NEC, Fuji Terminal Industry, Shibaura Electronics, etc.) T (Terminal) Sales of terminal connectors for consumer, automotive, and industrial equipment (General domestic manufacturers) I (Insulation) Mica sheets, laminated boards, various tapes, silicone materials, various resins (Nihon Mica, Nikkan Industry, Teraoka Seisakusho, Shin-Etsu Astech) C (Connector) General harnesses for consumer and industrial equipment Various sensor assembly products Various heater assembly products Power cord assembly products Special cable assembly products
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