Significantly improved circuit density! A substrate that enables more three-dimensional and high-density configurations.
"Build-Up PWB" mounts components on the connection via pads. Due to fewer restrictions on through holes, it significantly increases circuit density. By combining our unique machining technology, we have achieved a more three-dimensional and high-density configuration. Filled vias with copper plating are also available (subject to separate consultation). 【Features】 ■ Components mounted on connection via pads ■ Fewer restrictions on through holes ■ Significantly increases circuit density ■ Three-dimensional and high-density configuration *For more details, please refer to the catalog or feel free to contact us.
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Japan Micron focuses on the manufacturing of printed circuit boards and provides development and design assistance for various types of boards, including sensor boards and module boards, as well as some assembly. Utilizing patents, proprietary equipment, and unique technologies, we achieve diverse functionalities such as high density, miniaturization, heat dissipation, thinness, high-frequency characteristics, energy efficiency, and three-dimensionality, ensuring high reliability and producing products that meet our customers' needs.